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51305072-300
Honeywell
Product Overview
The Honeywell 51305072-300 is a CE-compliant Local Control Network (LCN) I/O board, specifically designated as the CLCN-B board, engineered exclusively for integration with Honeywell’s TDC 3000X Enhanced Programmable Logic Controller Gateway (EPLCG) systems. As a critical redundant interface component, it serves as the dedicated physical link between the EPLCG module and the LCN “B” coaxial cable—complementing the CLCN-A board (51305072-200) to establish a redundant LCN communication path. This redundancy ensures uninterrupted data transmission between the EPLCG and the broader TDC 3000 distributed control system (DCS), even if one LCN cable path fails.
Designed to meet European Union (EU) EMC (Electromagnetic Compatibility) and Health and Safety Directives, the 51305072-300 bears the “CE Mark”—a mandatory requirement for industrial equipment shipped to EU countries post-January 1, 1996. It replaces legacy non-CE LCN-B interface boards (e.g., KLCN-CB) while maintaining full backward compatibility with TDC 3000X infrastructure, making it ideal for upgrading existing systems to meet EU regulatory standards and enhance communication reliability.
The 51305072-300 is primarily deployed in redundant EPLCG configurations (e.g., MP-REPLC3, MP-REPLC4, MP-REPLC7, MP-REPLC8) within TDC 3000X Dual Node Modules. It supports critical industrial automation tasks such as PLC-to-LCN data bridging in high-availability environments (e.g., oil & gas refineries, power generation plants, and manufacturing facilities) where downtime is unacceptable. Its robust design focuses on electromagnetic interference (EMI) reduction, cable shield grounding, and mechanical stability to ensure consistent performance in controlled industrial settings.
Key Features
CE Compliance & Regulatory Adherence
Meets EU EMC Directive (89/336/EEC) and Health and Safety Directive (73/23/EEC), certified with the “CE Mark” for legal deployment in EU member states.
Complies with global industrial standards, including ANSI/ISA-12.12.01-2015 (intrinsic safety for industrial control systems) and EN 60079-0/11/15 (standards for explosive atmospheres), ensuring compatibility with hazardous location requirements for Class I, Division 2 and Zone 2 environments.
Redundant LCN “B” Cable Interface & Grounding
Dedicated to LCN “B” coaxial cable connections, working in tandem with the CLCN-A board (51305072-200) to create a redundant LCN communication path. This redundancy eliminates single points of failure, critical for high-availability EPLCG operations.
Features shielded connectors and a screw-mounted metal faceplate (required part: 51304982-100) that establishes a contiguous ground path from the module chassis to the LCN “B” cable shield. This design minimizes EMI emissions and susceptibility, preserving signal integrity in noisy industrial environments—an improvement over legacy clip-mounted boards.
System Compatibility & Integration
Exclusively compatible with Honeywell TDC 3000X EPLCG systems, including all redundant configurations (MP-REPLC3, MP-REPLC4, MP-REPLC7, MP-REPLC8) and select nonredundant setups requiring LCN redundancy.
Works seamlessly with EPLCG core components, including the EPLCI (Enhanced PLC Interface) board (51400997-200), EPLCI I/O board (51304812-200), and K2LCN processor boards (51401551-x00/51402615-x00). It supports up to 16 PLC connections per EPLCG module when paired with redundant communication paths.
Serves as a drop-in replacement for the legacy KLCN-CB board (51304544-100), requiring no modifications to existing EPLCG chassis or wiring—only node address reconfiguration to align with the EPLCG module’s assigned LCN node.
Node Address Configurability
Equipped with a jumper-based address pack to set the LCN node address, ensuring alignment with the EPLCG module’s assigned node on the LCN. Node addresses follow TDC 3000X conventions (starting at “1,” incrementing numerically), with a mandatory parity jumper to maintain odd parity—critical for data integrity during LCN transmission.
Critical note: When paired with a K2LCN processor board, the node address must be configured exclusively on the 51305072-300 (not the K2LCN). The two boards’ address settings are logically ORed, so dual configuration will cause address conflicts and communication failures.
Industrial-Grade Durability
Constructed with a ruggedized PCB (Printed Circuit Board) and metal faceplate to withstand vibration (1g maximum operating vibration) and temperature fluctuations in controlled industrial environments (0°C to 50°C operating temperature range).
Supports shielded LCN “B” coaxial cables to further enhance EMI resistance. Connector designs feature secure latching mechanisms to prevent accidental disconnection during module operation, reducing unplanned downtime.
Technical Specifications
The Honeywell 51305072-300 is manufactured by Honeywell Inc.’s Industrial Automation and Control Division, classified as a CE-compliant LCN “B” I/O board (CLCN-B) engineered specifically for Honeywell TDC 3000X Enhanced Programmable Logic Controller Gateway (EPLCG) systems. It is designed for installation in TDC 3000X Dual Node Modules, with primary compatibility for redundant EPLCG configurations (MP-REPLC3, MP-REPLC4, MP-REPLC7, MP-REPLC8) and secondary compatibility for nonredundant setups requiring LCN redundancy.
Functionally, it serves as the dedicated interface for LCN “B” coaxial cables, establishing a redundant signal path alongside the CLCN-A board (51305072-200) to ensure uninterrupted LCN communication. Power for the board is derived from the host Dual Node Module’s power supply, which operates at a nominal 24 V DC or 28 V DC—consistent with TDC 3000X system power requirements.
In terms of environmental resilience, the board operates within a temperature range of 0°C to 50°C (32°F to 122°F) and can be stored in conditions ranging from -35°C to +70°C (-31°F to +158°F). It supports a relative humidity range of 10% to 80% (non-condensing), with a maximum wet bulb temperature of 20°C to 30°C. For mechanical stability, it withstands 1g of vibration during operation and 3.0g of shock for 10 milliseconds when enclosed in its original shipping packaging.
Regulatory certifications include the CE Mark (validating compliance with EU EMC and Health and Safety Directives), ANSI/ISA-12.12.01-2015 (for intrinsic safety in industrial control systems), EN 60079-0/11/15 (for explosive atmosphere compatibility), and UL certifications for Class I, Division 2 (Groups A–D) and Class I, Zone 2 (Group IIC) hazardous locations.
Mechanically, the board conforms to TDC 3000X Dual Node Module I/O slot specifications, designed for 19-inch rack-mount enclosures. It requires screw-mounted installation to the module’s rear I/O cage, paired with the dedicated CLCN-B faceplate (part number 51304982-100) for secure mounting, proper grounding, and EMI shielding.
Node address configuration is achieved via a jumper-based address pack, supporting LCN node addresses 1–64. A parity jumper is mandatory to maintain odd parity, as required by TDC 3000X LCN communication protocols. Signal integrity is enhanced by shielded LCN “B” cable connectors and a contiguous ground path between the board’s faceplate and the module chassis, which reduces EMI emissions and susceptibility.
The board is a direct replacement for the legacy KLCN-CB board (part number 51304544-100) in TDC 3000X EPLCG systems, requiring no chassis or wiring modifications beyond address reconfiguration. Key associated components include the EPLCI board (51400997-200), EPLCI I/O board (51304812-200), K2LCN processor board (51401551-x00 or 51402615-x00), CLCN-B faceplate (51304982-100), and CLCN-A board (51305072-200) for redundant LCN communication.
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